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BS 6542-1-1984 信息交换用软盘盒的文件结构和标记.第1部分:顺序文件分配结构规范

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【英文标准名称】:Filestructureandlabellingofflexiblediskcartridgesforinformationinterchange-Specificationforsequentialfileallocationstructure
【原文标准名称】:信息交换用软盘盒的文件结构和标记.第1部分:顺序文件分配结构规范
【标准号】:BS6542-1-1984
【标准状态】:现行
【国别】:英国
【发布日期】:1984-10-31
【实施或试行日期】:1984-10-31
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:信息传递;文件;数据传送;信息交流;信息块格式;情报系统;数据媒体;文档;标识符;磁盘;软盘;数据集;文件结构(计算机);数据布置;数据组织;数据块;数据介质
【英文主题词】:Datablocks;Datalayout;Datamedia;Dataprocessing;Datastructures;Definition;Definitions;Diskpacks;Fileorganization(computers);Files;Flexibledisks;Informationexchange;Informationinterchange;Labelling(process);Labels;Layout;Processing;Specifications;Tags(dataprocessing)
【摘要】:Requirementsfortheinterchangeofinformationbetweenusersofdifferentinformationprocessingsystems.
【中国标准分类号】:L75
【国际标准分类号】:35_220_21
【页数】:28P;A4
【正文语种】:英语


【英文标准名称】:Semiconductordevices-Mechanicalandclimatictestmethods-Bondstrength
【原文标准名称】:半导体器件.机械和气候试验方法.粘接强度
【标准号】:BSEN60749-22-2003
【标准状态】:现行
【国别】:英国
【发布日期】:2003-07-04
【实施或试行日期】:2003-07-04
【发布单位】:英国标准学会(BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:机械试验;电气工程;电子设备及元件;电子工程;试验;粘结强度;半导体;元部件;环境试验;半导体器件;气候试验;集成电路
【英文主题词】:
【摘要】:ThispartofIEC60749isapplicabletosemiconductordevices(discretedevicesandintegratedcircuits).Theobjectofthispartistomeasurebondstrengthordeterminecompliancewithspecifiedbondstrengthrequirements.NOTEThistestisidenticaltothetestmethodcontainedinclause6ofchapter2ofIEC60749(1996),amendment1,apartfromchangestothisclauseandrenumbering.1GeneraldescriptionofthetestSeventestmethodsaredescribed,eachhavingitsownpurpose,thatis:-methodsAandBareintendedfortestinginternalbondsofadevicebyadirectpullingoftheconnectingwire;-methodCisintendedforbondsexternaltothedeviceandconsistsofapeelingstressexertedbetweentheleadorterminalandtheboardorsubstrate;-methodDisintendedforinternalbondsandconsistsofashearstressappliedbetweenadieandasubstrateorsimilarface-bondedconfigurations;-methodsEandFareintendedforexternalbondsandconsistofapush-offorapull-offstressexertedbetweenadieandthesubstrate;-methodGisintendedtotestthemechanicalresistanceofwirebondstoashearforce.2Descriptionofthetestapparatus(forallmethods)Theapparatusforthistestshouldconsistofsuitableequipmentforapplyingthespecifiedstressonthebond,leadwireorterminalsasrequiredinthespecifiedtestmethod.Acalibratedmeasurementandindicationoftheappliedstressinnewtons(N)atthepointoffailureshouldbeprovidedbyequipmentcapableofmeasuringstressesuptoandincluding100mNwithanaccuracyof±2,5mN,stressesbetween100mNand500mNwithanaccuracyof±5mN,andstressesexceeding500mNwithanaccuracyof±2,5%oftheindicatedvalue.Thistestisintendedtobeappliedtothewire-to-diebond,wire-to-substratebond,orthewire-to-terminalbondinsidethepackageofwire-connectedsemiconductordevicesbondedbysoldering,thermocompression,ultrasonicandotherrelatedtechniques.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:24P;A4
【正文语种】:英语


Product Code:SAE AS9687
Title:Bolt, Machine - Hexagon Head, Drilled, 1 Hole, Pd Shank, Steel Ams 6304, Diffused Nickel Cadmium Plate, .3125-24 Unfj-3a
Issuing Committee:E-25 General Standards For Aerospace And Propulsion Systems
Scope:No scope available.